20161118 – Marketing, Engineering, Technology Speakers Needed on 05/16/2017 for Palm Springs, California for VOICE 2017 – Free Speaker Bureau Expert Wanted
05/16/2017 through 05/17/2017
Hyatt Regency Indian Wells Resort & Spa
Palm Springs, California
VOICE 2017
Preferred Meeting Topics:
Marketing, Engineering, Technology
Booking Deadline for Speaker: 11/18/2016
Demographic Mix of the Audience:
50% Male
50% Female
Age Group(s) Expected in Audience:
20-60
Number of Attendees Expected
150+
Special Details About This Meeting/Audience:
VOICE, the annual Advantest Developer Conference, is the leading conference for the growing international community of users and strategic partners involved with Advantest’s V93000 and T2000 SoC test platforms as well as Advantest memory testers, handlers and test cell solutions.
The VOICE program includes technical presentations, a Partners’ Expo, and interactive discussion sessions for users of the V93000 and T2000 SoC test platforms as well as Advantest memory testers, handlers and test cell solutions, offering comprehensive learning and networking opportunities for all attendees.
The conference offers a unique opportunity to take part in making semiconductor testing operations as efficient and cost-effective as possible. Attendees gain and share valuable insights, build long-lasting relationships and learn what’s new about Advantest test equipment, handlers and applications.
Traditionally held in the United States, VOICE expanded internationally for the first time in 2015, with an event in Shanghai. In 2016, the international location was Hsinchu, Taiwan. In 2017, VOICE will return to Shanghai, in addition to the Palm Springs, California location.
We will select papers and presentations for VOICE 2017 from the following eight topic areas:
- Hot Topics: New market drivers and future trends including V93000 Wave Scale RF/MX, automotive power analog, Internet of Things (IoT), emerging wireless standards, and test challenges at next-generation technology nodes
- Device Specific Testing: Techniques for testing MCUs, ASICs, PMICs, automotive radar, sensors, memory, baseband, cellular, multi-chip packages, and more
- Hardware Design and Integration: Tester/handler integration, probe and package loadboard design, challenges of new package technologies and fine pitch devices, and more
- Improving Throughput: Test time reduction, increased multi-site, multi-site efficiency, concurrent test, and more
- Reducing Time-to-Market: DFT, pattern simulations/cyclization, automatic test program generation, system-level test, and more
- New Hardware/Software Test Solutions: Solutions utilizing the latest hardware or software features
- Test Methodologies: Techniques for testing DC, RF, mixed signal or high speed digital devices
- Product Engineering: Software and tools for data analysis, test program documentation/versioning and production test elimination techniques
Scope of the Overall Organization:
Local, National
Name of Meeting Organizer:
None Given
>> Click to Contact VOICE 2017 >>
>> Click to Visit Speaker Submission Page >>
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